Omniprobe - 3 Post Cu Lift-out Grids with Side Access, Pkg 100

Lift-out Grids from Omniprobe

3 post copper
Diameter 3mm (one edge lower)
Thickness (nominal) : 35 µm
Post Downset (Nominal) : 5 µm

These grids specifically designed for in-situ lift-out. The grids include multiple indexed mounting locations with both vertical bar and "V" shaped attachment surfaces. One edge of this grid has been lowered to allow for easier side access.