Omniprobe - 3 Post Cu Lift-out Grids, Pkg 100
Lift-out Grids from Omniprobe
3 post copper Diameter 3mm Thickness (nominal) : 30 µm Post Downset (Nominal) : 10 µm
These grids specifically designed for in-situ lift-out. The grids include multiple indexed mounting locations with both vertical bar and "V" shaped attachment surfaces.They have a sharp edge at the "downset", which makes it very easy to see exactly where to place the lamella when mounting to the side of a post.