Lift-out Grids from Omniprobe
3 post copper
Diameter 3mm
Thickness (nominal) : 30 µm
Post Downset (Nominal) : 10 µm
These grids specifically designed for in-situ lift-out. The grids include multiple indexed mounting locations with both vertical bar and "V" shaped attachment surfaces.They have a sharp edge at the "downset", which makes it very easy to see exactly where to place the lamella when mounting to the side of a post.