Omniprobe - 3 Post Cu Lift-out Grids with Shallow Downset, Pkg 100
Lift-out Grids from Omniprobe
3 post copper
Thickness (nominal) : 30 µm
Post Downset (Nominal) : 5 µm
These grids specifically designed for in-situ lift-out. The grids include multiple indexed mounting locations with both vertical bar and "V" shaped attachment surfaces. These grids have a more shallow downset and slightly wider center post than the standard 3 post copper grid.