SPI Conductive Silver Epoxy
Technical information
The SPI #05000 formulated silver epoxy is mixed at a non-critical 1 to 1
ratio by weight or volume, and it will provide a quick conductive bond at or
above room temperature. Typical cure times are approximately 4 hours at 75°C.
Note: Do not try to cure below 75°F/24°C. Small amounts can take
several hours to cure at room temperature. Cure times can be accelerated
by heating. For the fastest curing times, maximum conductivity and
adhesion, heat the bond to between 175° - 250°F (79° - 121°C)
for 10 minutes and allow to cool. Cured #05000 silver epoxy typically
exhibits resistivity as low as 0.01 ohm-cm and resists most common
laboratory solvents. Working temperature range is -131° to 212°F
(-55° to 100°C). Typical working pot life is 10 minutes from
mixing.
Off-gassing: Best result are obtained by spreading out the paste as a
thin film, or as thin as one can use to accomplish the job at hand.
Thicker layers require longer times to off-gas, thinner layers less time.
If the sample can stand it, a brief exposure at some higher-than-room
temperature will cause the last bit of curing to take place, improving
greatly the high vacuum compatibility characteristics.
Special notice:This product is sold for industrial and research
use only, especially for the mounting of specimens for electron
microscopy, specifically for scanning electron microscopy (SEM). There
are of course numerous other potential applications for the SPI #5000-AB
Conductive Silver Epoxy, however, it will be the responsibility of the
customer to determine the suitability of this product for any other
application.
To Ask a Question or Make a Comment
To Place an Order or Request a Quote
Return to:
Monday October 13, 2008
© Copyright 1998 - 2008. By Structure Probe, Inc.
Contacting SPI Supplies and Structure Probe, Inc.
All rights reserved.
All trademarks and trade names are the property of their respective owners.
Privacy Policy
Worldwide Distributors, Representatives, and Agents
