M-Bond™ 610 Adhesive System

Chinese

Explanation of Hazardous Labels This high-performance two component epoxy-phenolic resin was formulated specifically for bonding strain gages and temperature sensors. When properly cured, this two part adhesive is useful for temperatures ranging from deep cryogenic, -269° C (-452° F) (4° K) to 370° C (700° F) for short periods, and -269° C (-452° F) (4° K) to 260° C (500 °F) for long periods. Note that for transducer applications, the recommended temperature upper limit is 230° C (450° F). Like other organic materials, the higher temperature lifetime is limited by oxidation and sublimation effects.

We realize that sometimes for these non-strain gage applications, information such as thermal coefficient of expansion or electrical resistivity would be useful. But, such information is not needed for the application that M-Bond 610 was originally developed, and such data does not exist so far as we know. An understated potential safety risk: We are addressing now the cured block, something that to most people is about as inert of a material as one will find. But the standard practice in many laboratories is to use a small jeweler's (or even a small hack) saw to cut the block down to the right size, sometimes even to shape it. We want to address the dust that is generated and how its exposure can and should be minimized.

	SPI #	Each		In Stock
	05059-AB	$ 127.20		Yes