SPI-Chem™ Epoxy Release Agent

Chinese

This release agent product is used worldwide to facilitate the removal of the cured mount from the ring form and surface against which it has been cured.

Use of epoxy embedding resin formulations:

We would recommend the use of SPI-Chem™ Epoxy Release Agent which will greatly aid in the removal of the embedment from the mold. We have tested the release agent with SPI-Chem™ Cold Mount Epoxy, Koldmount™ Fast Curing Cold Mounting Kit and ConductoBed Carbon Black Filled Conductive Epoxy and found that the release agent is indeed compatible with the epoxy.

Easy to use instructions:

Spread a thin uniform layer of the product on a suitable sized piece of plate glass. Lightly grease the bottom of the ring form that has already been ground on a 400-grit silicon carbide disc. Place the greased ring form on the release film and then pour in the epoxy. After curing, the mount is easily removed.

	Size	SPI #	Each		In Stock
	1 fluid oz. (30 ml)	01364-AA	$8.04		Yes
	1/2 pint (236 ml)	01364-AB	15.53		Yes