SPI Supplies

Tempfix™ Mounting Adhesive

Important information about characteristics and properties

Tempfix™ is a resin that does not contain any solvents or other volatiles and is inert and other wise stable under conditions of high vacuum. It is not "sticky" or "adhesive" at room temperature but becomes adhesive in the vicinity of 40°C and melts at 120°C. Tempfix exhibits a surface after exposure to the just mentioned temperatures that is very smooth so that even the smallest of particles can be easily imaged in any scanning electron microscope (SEM) and without any undesirable interference from the background surface.

When used on aluminum mounts, if desired, the Tempfix can be readily removed with common laboratory solvents and an ultrasonic cleaner.

Please return to the Tempfix product main page should you want to place an order.

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Sunday September 07, 2008
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