SPI Silver Epoxy Properties of Cured Resin

A unique set of properties for a unique silver epoxy formulation SPI# 05067-AB

Property	Typical Values
Color	Silver
Specific gravity	2.45
Viscosity after mixing @ 250°C	Smooth paste
Mix ratio, parts by weight Hardener/Resin	6 parts Hardener/100 parts Resin
Operating temperature range, °C	-60 to +110
Hardness, Shore D	80
Coefficient of expansion, cm/cm/°C	49 x 10^-6
Thermal conductivity, cal-cm/cm²/sec °C	37 x 10^-4
Outgassing (NASA specification)	Passes
VCM (Volatile Condensable Materials NASA), %	0.040
Volume Resistivities and Tensile Shear as a Function of Cure Time

Bond Line Cure Time	Volume Resistivity @ 25 ° C, ohm-cm	Tensile Shear Aluminum/Aluminum, psi
24 hours @ 25°C	0.007	700
2 hours @ 65°C	0.001	1000
1 hour @ 110°C	0.0006	1600
15 minutes @ 150°C	0.0005	1600
5 minutes @ 160°C	0.0003	-

Special notice:
This product is sold for industrial and research use only, especially for use for the mounting of specimens for electron microscopy, specifically scanning electron microscopy (SEM). There are, of course, numerous other potential applications for the SPI #05067-AB Silver Epoxy, however it will be the sole responsibility of the customer to determine the suitability of this product for any other application.

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