SPI Silver Epoxy Application and Mixing Instructions for #05067-AB
The "no problem" conductive epoxy for many varied applications
Follow these easy to use instructions for the best
results:
a) Carefully clean and dry all surfaces to be bonded.
For the scanning electron microscopy application where the strength
of the adhesive bond is not so much of an issue, this step
is not as important as for other applications.
b) Remove the clamp and thoroughly mix the SPI Two Part
Silver Epoxy adhesive system components in the handy
mixing dispenser package until color is uniform throughout.
c) Apply this completely mixed adhesive to the prepared
surfaces, and gently press these surfaces together. For
vacuum and high vacuum applications, the thoroughness of
the mixing is perhaps even more important than
applications generally.
For strong reliable bonds, maintain good uniform contact
pressure until the adhesive is cured. This is particularly
important when using this
conductive epoxy system to "glue" sputter coater targets
to the sputter coater heads.
Other information and cure information
SPI #05067 AB has a 60 minute "pot life" after thorough
mixing in the accurately proportioned two part system
package and a very low magnitude exotherm during the curing cycle.
This superior adhesive develops most of its major
physical properties after 18 hours at room temperature (at
25° C); longer cures up to 72 hours at 25° C are required
for fully matured bonds. For vacuum
applications, one should really wait the full 72 hours (at
room temperature) for the maximum vacuum characteristics.
However that time frame can be shortened
considerably (for maximum vacuum characteristics) via the
application of temperature
during the cure time, for example, 14 hours at 65° C or 8 hours at
100° C. Still faster cures are possible at still higher temperatures, but
with less predictable electrical and other characteristics.
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Wednesday March 10, 2010
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