This is a fast curing, strong adhesive for the mounting of samples for SEM
examination. The epoxy cures without pressure or heat in five minutes or
less. The speed of the cure can be controlled by the amount of 'hardener'
used when mixing, the more the hardener, the faster the cure. We recommend
using always a slight excess of hardener for samples eventually going into
vacuum systems to make sure that there is no remaining unreacted functional
groups in the epoxy. Each kit produces 1 fl. oz. (28.8 grams) of epoxy,
which means that one kit will be able to mount some larger number of
samples, the exact number depending on how just what kinds of samples are
being mounted.
This is an often asked question. For the typical SEM user, this fast curing
epoxy is probably good enough, provided enough time (and/or temperature) is
given for complete cure. As indicated above, using an excess of hardener to
ensure complete cross-linking of all monomer into the epoxy structure is
also desirable. But for those wanting something a bit more vacuum
compatible, we would recommend
M-Bond 610.
The highest temperature this product in its cured state should be taken is
225°C (437°F).
The well-cured resin is resistance to attack by osmium tetroxide.
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