Wafer-mount™ Mounting Adhesives
Use Instructions
Instructions for Use:
1) Cut the Wafer-Mount™ sheet to the desired shape and size and peel the clear plastic
adhesive tape away from the backing paper. Place the substrate, face down, on the backing
paper then place the plastic adhesive tape, with the adhesive side down, over the part.
Press firmly to assure good adhesion, then peel off the backing paper.
2) Process the substrate as required, then remove parts by heating in a well-ventilated
area to 149°C (300°F) for 2-3 minutes until the adhesive softens. Use a tool to slide
the substrate off the mounting plate.
3) Clean with acetone or
methyl ethyl ketone (MEK) according to the process diagram for cleaning.
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Monday March 22, 2010
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