Crystalbond™ and Wafer-mount™ Mounting Adhesives

Use whenever temporary mountants are required

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Appearance of Crystalbond
509, 555, or 590

Crystalbond™ 590 bonds an
advanced ceramic which is diced
into 25-50 mil sections.

Crystalbond™ and Wafer-Mount™ washaway mounting adhesives are ideal materials for temporarily mounting objects that require dicing, polishing, and other machining processes. These adhesives exhibit high bond strength and adhere readily to metals, glass and ceramics. When processing is complete, Crystalbond™ and Wafer-Mount™ adhesives are removed by reheating and cleaning with a wide range of different solvents.

Crystalbond Products

This family of adhesives has won wide acceptance in metallography and other materials science sample preparation laboratories because of the success users have had with the preservation of the most delicate of structures. Make sure you understand and compare the differences in characteristics between the different products in this unique family of temporary adhesives.

Typical Applications:

Machining advanced ceramics.
Lapping and polishing optical components.
Dicing ceramic substrates and semiconductor wafers.
Dicing ferrites, glasses and piezoelectrics.
Dicing metal and optical single crystals.
Mounting cross-sections for electron microscopy.
Backfilling components for temporary mechanical support.

Vacuum compatibility:
We are often asked about the vacuum compatibility of the Crystalbond products. We do not have hard information on that subject except we do know of users who routinely put samples mounted in Crystalbond 509 into their SEMs. We do not know at this point if such SEMs are conventional or UHV systems. At this point, we would not recommend any of the other Crystalbond products for use in high vacuum, but it is mainly for lack of any information, rather than knowledge that they would not work. We would welcome any customer experiences, good or bad, working with 509 or any of the other Crystalbond products in their SEMs.

Adhesion of the mounting material to the sample:
Generally speaking, users report excellent adhesion. The best adhesion is obtained when the part to be embedded is first heated to the temperature of the flow/melting point of the resin being used. If this is not done there can inferior adhesion might be experienced. Also, if there is organic contamination on the surface, and if a metal, then a short "plasma cleaning" in the SPI Supplies Plasma Prep™ II plasma etcher will generally improve adhesion greatly.

Crystalbond 509
Provides excellent adhesion and minimizes clogging of diamond tools compared to waxes. Transparent in thin cross-sections. Soluble in acetone or 509-S stripper, an odorless, non-flammable, biodegradable water rinse-off solvent. Crystalbond 509 is the strongest of the various Crystalbond products and is much stronger than, for example, Crystalbond 555 and Crystalbond 555 HMP. We do not have any lap-shear measurements for a quantitative comparison, but semi-quantitatively, this would be the inescapable conclusion of anyone who has used both. Special protocols have been developed for heat-sensitive samples.

Resistance to water:
Will not dissolve in water but it might swell slightly after long term water exposure. Most dicing operations are relatively quick (less than thirty minutes per substrate) so extended exposure time is generally not an issue.

Characteristics:
Solvent:	Acetone
Color and Appearance:	0.875" (22.2 mm) diameter x 7" (178 mm) light amber, amber or clear "logs".
	(Note: The clear logs may appear to have a blue tint).
Flow/Melting Point:	121°C (250°F)
Viscosity at Flow Point:	6000 cps
Softening Point:	71°C (159.8°F)
Weight:	~ 0.2 lb/90g per log

	SPI #	Each	In Stock
Crystalbond 509
Each stick (90g)	05110-AB	$25.00	Yes
Pack of 5 sticks	05110-AF	114.00	No

Storage conditions: Room temperature
Non-hazardous from the standpoint of shipping

Crystalbond 555 and 555 HMP
Low melting point adhesive systems for moderate-stress machining processes. Transparent in thin cross-sections.

Crystalbond 555

Characteristics:
Solvent:	Hot water (the hotter the water, the faster will be the dissolution
	rate. It will dissolve even at room temperature but very slowly.)
Color and Appearance:	Irregular lumps of water white clear solid
Dimensions:	0.5" (12.5mm) x 1" (25.4mm) x 7" (178 mm) stick
Flow Point:	54°C (120°F)
Viscosity at Flow Point:	500 cps
Softening Point:	52°C (125.6°F)
Weight:	~ 0.15 lbs (68g)

	SPI #	Each	In Stock
Crystalbond 555
Each stick (90g)	05111-AB	$20.81	Yes
Pack of 10 sticks	05111-BA	187.27	No

Storage conditions: Room temperature Non-hazardous from the standpoint of shipping

Crystalbond 555 HMP

Characteristics:
Flow Point:	66°C (150°F)
Viscosity at Flow Point:	500 cps
Dimensions:	0.5" (12.5mm) x 1" (25.4mm) x 7" (178 mm) stick
Weight:	~ 0.15 lbs (68g)

	SPI #	Each	In Stock
Each stick	05112-AB	$21.68	Yes
Pack of 10 sticks	05112-BA	195.08	No

Storage conditions: Room temperature
Non-hazardous from the standpoint of shipping

Crystalbond 590
High strength, resilient adhesive system, ideal for dicing miniature and tall parts.

Characteristics:
Resistance to water:	Will not dissolve in water but it might swell slightly after long term water exposure. Most dicing operations are relatively fast (less than thirty minutes per substrate) so extended exposure time is generally not an issue.
Solvent:	Methanol or 590-S Stripper
Color and Appearance:	Rectangular brown sticks
Dimensions:	0.625" (16 mm) x 1.25" (31.8mm) x 7.5" (191 mm)
Flow Point:	150°C (302.2°F)
Viscosity at Flow Point:	9000 cps
Softening Point:	125°C (257°F)
Weight per stick:	~ 0.5 lb (227g)

	SPI #	Each	In Stock
Crystalbond 590
Each stick (225g)	05113-AB	$46.82	Yes
Pack of 2 sticks	05113-AC	84.27	Yes

Storage conditions: Room temperature
Non-hazardous from the standpoint of shipping

Wafer-Mount Products:

Wafer-Mount 562, a film adhesive, provides a uniform glue line between a ceramic substrate and mounting block.

Wafer-Mount 562
Thermoplastic film adhesive with good adhesive properties. Ideal for mounting fragile, thin substrates for which a predictable film thickness is required.

Characteristics:
Resistance to water:	Will not dissolve in water but it might swell slightly after long term water exposure. Most dicing operations are relatively quick (less than thirty minutes per substrate) so extended exposure time is generally not an issue.
Solvent:	Acetone or Stripper 562-S
Flow Point:	93°C (200°F)
Dimensions:	0.002" (0.05 mm) x 8" (203 mm) x 10" (254 mm) sheets
Color:	White
Solvent:	Acetone or 562-S

	SPI #	Each	In Stock
Wafer-Mount 562
Pack of 10 sheets	05115-BA	$83.23	Yes
Pack of 20 sheets	05115-CA	149.82	No

Storage conditions: Room temperature
Non-hazardous from the standpoint of shipping

Wafer-Mount 559
Semi-rigid solvent-resistant plastic film with pressure sensitive soluble adhesive layer. Ideal for scribing wafers with vacuum hold down fixturing.

Characteristics:
Solvent:	Acetone or methyl ethyl ketone.
Flow Point:	Not applicable
Dimensions:	0.005" (0.127mm) x 10" (254 mm) x 10" (254 mm) sheets
Color:	Clear

	SPI #	Each	In Stock
Wafer-Mount 559
Pack of 10 sheets	05131-BA	$156.06	Yes
Pack of 20 sheets	05131-CA	280.91	No

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