Instructions for Use

Use Instructions for Wafer-Mount™ 559

  1. Cut the Wafer-Mount™ sheet to the desired shape and size and peel the clear plastic adhesive tape away from the backing paper. Place the substrate, face down, on the backing paper then place the plastic adhesive tape, with the adhesive side down, over the part. Press firmly to assure good adhesion, then peel off the backing paper.
  2. Process the substrate as required, then remove parts by heating in a well-ventilated area to 300 °F for 2-3 minutes until the adhesive softens. Use a tool to slide the substrate off the mounting plate.
  3. Clean with acetone or MEK according to the process diagram for cleaning.