Use Instructions for Wafer-Mount™ 562
- Cut the Wafer-Mount™ sheet to the desired shape and size, and position
on a ceramic or glass mounting plate. Use multiple preforms as required
to fill in small cavities or gaps caused by warping of the substrate.
- Using a hot plate or oven, heat the mounting plate to 195-210 °F.
Make sure to work in a well-ventilated area, and do not overshoot the
flow temperature, otherwise, the adhesive will begin to decompose
and degrade in strength.
- Using a weight, apply even pressure to the substrate to remove air
bubbles and to ensure that the substrate is parallel to the plate.
Remove the mounting plate from the heat source and allow it to cool
slowly to room temperature until the adhesive is hardened. Cool for
20-30 minutes prior to processing.
- Process the substrate as required, then remove parts by re-heating
the mounting block to the flow temperature. Use a tool to slide the
substrate off the mounting plate.
- For detailed cleaning procedures, refer to the section describing the
562-S Stripper.
