When prethinning, the Dimpler® produces an ultra-high area for successful, artifact-free ion thinning, while maintaining a greater edge thickness to help prevent breakage while handling. The thickness achieved will depend on the material being thinned; however, hard specimens typically can be dimpled to less than 5 µm with a 100 µm thick periphery for specimen support. Use with SPI molybdenum support rings and the SPI 3 mm Disc Punch. For heat sensitive samples, consider using the SPI Diamond Ringed Grids. Accessory package: Each newly purchased Dimpler® comes with a complete accessory package which includes one each of the following items: Specimen platen assembly, specimen mounting jig assembly, sapphire flat, set of "Dimpling" tools (1i, 2iM, 2iT, 3i, 4iM, 4iT ), 1 and 3 µm polycrystalline diamond slurry with lapping fluid, mounting wax, Sytron HT50, 0.1 µm and 0.05 µm alumina. In addition, there are a number of "Dimpling Accessories" that could be useful for working with specific kinds of samples.
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