SPI Supplies

SPI-CHEM™ Osmium Tetroxide

Technical Data Sheet



Chinese

Also listed as: Osmic acid, osmic anhydride

Chemical Formula: OsO4

Uses: Tissue fixative and selective tissue stain in preparation for electron microscopic examination. Also used for the staining of certain plastics and phases in certain plastics. Catalyzes chlorate oxidations. Strong oxidizing agent and catalyst. Conversion of olefins to glycols, steroid synthesis, etc. and is also used as the osmium "source" for the OPC line of osmium plasma coaters manufactured by Nippon Laser and Electronics, Nagoya, Japan.

Physical and Chemical Data:

Chemical       Mol.      %          Appearance       Specific    Purity*
Name           Wt.       Os                           Gravity       %

Osmium       254.20    74.82    Colorless monoclinic   4.9       99.995
Tetroxide

Appearance: Solid crystals - yellow crystalline mass
Softening Point: 35° C/95° F
Boiling Point: 130° C/266° F - Begins to sublime and distill well below the boiling point.

Solubilities (g/100 ml solvent):

               Cold Water     Hot Water     CCl4

                  5.07          6.23        250

Soluble in alcohol or ethyl ether with decomposition.

Caution:

Osmium tetroxide vapors are poisonous and highly irritating to the skin, eyes, and respiratory membranes. Minimum perceptible concentration 0.02 mg/liter of air. Become familiar with the information on the MSDS for this material before attempting its use.

There is no perceptible amount of insoluble reside when dissolved in CCl4, nonvolatile matter is less than USP requirements, and heavy metals are not more than the equivalent of 0.005% Pb.

The product transcends the requirements of USP, ACS, and Department of Defense, Defense Medical Supply No. 6 standards. Packing also complies with all appropriate standards.

* Internal and independent analyses have confirmed the above % purity on standard batch runs.

The information, based upon literature and our testing and manufacturing experience, is intended for use by persons having technical skill and training, at their own discretion and risk. It is not a guarantee of an end product or research or manufacture, and we assume no liability to that end. The information is not intended as a recommendation to use any compound involving the infringement of any patent nor does the sale of any compound grant or imply immunity under any patent.


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Sunday September 07, 2008
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