Ultra Low Viscosity Kit
Instructions for Use:
Ultra Low Viscosity Kit SPI# 02682
The Ultra Low Viscosity Kit is characterized by a, viscosity of only 20 cps at 25°C. This kit is
ideal for rapid embedding schedules and facilitates cutting large sections, even from
difficult materials. The article (Oliveira L. et. al. 1983) uses a wide variety
of plant tissues for embedment with VCD-HXSA* and compares its usefulness to
that of Epon and Spurr's resin.
PROCEDURE:
Initial Fixation - 2-4% (v/v) glutaraldehyde in O.lM cacodylate buffer, pH 7.0.
Postfixation - 1-2% (w/v) buffered osmium tetroxide. In some cases ruthenium red is added
(0.1%, w/v) to the postfix to enhance contrast of the sections.
Dehydration - Dehydrate in a standard methanol series.
| Mixing schedules: |
| VCD | 10g |
| n-OSA | 20g |
| BDE | 0.3g |
| DMAE | 0.3g |
Infiltration:
Replace dehydrating agent at two hour intervals with 3:1, 1:1, 1:3 solutions of the
solvent: embedding medium. Then transfer materials to 100% embedding medium overnight.
Embed in BEEM reg; capsules and place in over at 50deg; C - 60 deg; C for 6-12 hours respectively.
For rapid embedding, infiltrate each step for 15 followed by two changes in 100% embedding medium.
Reference:
Oliveira L. et. at., J. Microscopy 132, 195-20l (1983)
HXSA has been substituted with n-OSA (Octynel Succinic Anhydride)
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Sunday March 21, 2010
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